THERM PAD 300MMX3MM W/ADH COPPER | Laird Technologies EMI
Thermal Pad Copper 300.00mm x 3.00mm Rectangular Adhesive - One Side
Images may differ
Unit Price ($ / pc.)
1.544795 $
*
Available: 193 pcs.
Next delivery: 3003 pcs.
Manufacturer Leadtime: 13 Weeks **
Description
The 57GF3030011C000100 is a common industry Pads, Sheets housed in a RoHS compliant Standar package by Laird Technologies EMI made. The 57GF3030011C000100 is using SPQ 200 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
Mfr | Laird Technologies EMI |
Series | GOF3000 |
Package | Bulk |
Product Status | Active |
Usage | Thermal Gasket |
Type | Graphite-Pad, Sheet |
Shape | Rectangular |
Outline | 300.00mm x 3.00mm |
Thickness | 0.0394" (1.000mm) |
Material | Copper - Graphite, Foam |
Adhesive | Adhesive - One Side |
Backing, Carrier | - |
Color | Copper |
Thermal Resistivity | 0.45°C/W |
Thermal Conductivity | 2.2W/m-K |
Shelf Life | 12 Months |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | 73°F (23°C) |
Storage | - |
Logistics
Country of origin | HK |
Customs tariff number | - |
Original Packaging | Reel with 200 pieces |
Compliance
RoHS conform | Yes |
HTSUS | 8504.40.9580 |
SVHC free | Yes |
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