IGBT 3 CHIP 600V 75A WAFER | Infineon Technologies
IGBT Trench Field Stop 600 V 75 A Surface Mount Die
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Unit Price ($ / pc.)
$
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Available: 158 pcs.
Next delivery: 2268 pcs.
Available in 1 Weeks
Manufacturer Leadtime: **
Quantity
Price per unit*
100 pcs.
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**Subject to prior sale
Description
The SIGC39T60EX7SA1 is a common industry Single IGBTs housed in a RoHS compliant Die package by Infineon Technologies made. The SIGC39T60EX7SA1 is using SPQ 1 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
| Mfr | Infineon Technologies |
| Series | TrenchStop |
| Package | Bulk |
| Product Status | Active |
| IGBT Type | Trench Field Stop |
| Voltage - Collector Emitter Breakdown (Max) | 600 V |
| Current - Collector (Ic) (Max) | 75 A |
| Current - Collector Pulsed (Icm) | 225 A |
| Vce(on) (Max) @ Vge, Ic | 1.85V @ 15V, 75A |
| Switching Energy | - |
| Input Type | Standard |
| Td (on/off) @ 25°C | - |
| Test Condition | - |
| Operating Temperature | -40°C ~ 175°C (TJ) |
| Mounting Type | Surface Mount |
| Package / Case | Die |
| Supplier Device Package | Die |
| Base Product Number | SIGC39 |
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Logistics
| Country of origin | HK |
| Customs tariff number | - |
| Original Packaging | Reel with 1 pieces |
Compliance
| RoHS conform | Yes |
| HTSUS | 8504.40.9580 |
| SVHC free | Yes |
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