BGA PIN ADAPTER 1.27MM SMD | Preci-Dip
360 (19 x 19) Pos BGA Socket Gold Through Hole
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Unit Price ($ / pc.)
22.457815 $
*
Available: 461 pcs.
Next delivery: 8631 pcs.
Manufacturer Leadtime: 20 Weeks **
Description
The 550-10-360M19-001166 is a common industry IC Sockets housed in a RoHS compliant Standar package by Preci-Dip made. The 550-10-360M19-001166 is using SPQ 19 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
Mfr | Preci-Dip |
Series | 550 |
Package | Bulk |
Product Status | Active |
Type | BGA |
Number of Positions or Pins (Grid) | 360 (19 x 19) |
Pitch - Mating | 0.050 (1.27mm) |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | 10.0μin (0.25μm) |
Contact Material - Mating | Beryllium Copper |
Mounting Type | Through Hole |
Features | Closed Frame |
Termination | Solder |
Pitch - Post | 0.050 (1.27mm) |
Contact Finish - Post | Gold |
Contact Finish Thickness - Post | 10.0μin (0.25μm) |
Contact Material - Post | Brass |
Housing Material | FR4 Epoxy Glass |
Operating Temperature | -55°C ~ 125°C |
Termination Post Length | 0.098 (2.50mm) |
Material Flammability Rating | UL94 V-0 |
Current Rating (Amps) | 1 A |
Contact Resistance | 10mOhm |
Base Product Number | 550-10 |
Logistics
Country of origin | HK |
Customs tariff number | - |
Original Packaging | Reel with 19 pieces |
Compliance
RoHS conform | Yes |
HTSUS | 8504.40.9580 |
SVHC free | Yes |
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