CONN IC DIP SOCKET 24POS TINLEAD | Amphenol ICC (FCI)
24 (2 x 12) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Tin-Lead Through Hole
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Unit Price ($ / pc.)
0.21345 $
*
Available: 570 pcs.
Next delivery: 10920 pcs.
Manufacturer Leadtime: 11 Weeks **
Description
The DILB24P-223TLF is a common industry IC Sockets housed in a RoHS compliant Standar package by Amphenol ICC (FCI) made. The DILB24P-223TLF is using SPQ 20 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
Mfr | Amphenol ICC (FCI) |
Series | DILB |
Package | Tube |
Product Status | Active |
Type | DIP, 0.6" (15.24mm) Row Spacing |
Number of Positions or Pins (Grid) | 24 (2 x 12) |
Pitch - Mating | 0.100" (2.54mm) |
Contact Finish - Mating | Tin-Lead |
Contact Finish Thickness - Mating | 100.0μin (2.54μm) |
Contact Material - Mating | Copper Alloy |
Mounting Type | Through Hole |
Features | Open Frame |
Termination | Solder |
Pitch - Post | 0.100" (2.54mm) |
Contact Finish - Post | Tin-Lead |
Contact Finish Thickness - Post | 100.0μin (2.54μm) |
Contact Material - Post | Copper Alloy |
Housing Material | Polyamide (PA), Nylon |
Operating Temperature | -55°C ~ 125°C |
Termination Post Length | 0.124" (3.15mm) |
Material Flammability Rating | UL94 V-0 |
Current Rating (Amps) | 1 A |
Contact Resistance | 30mOhm |
Base Product Number | DILB24P |
Logistics
Country of origin | HK |
Customs tariff number | - |
Original Packaging | Reel with 20 pieces |
Compliance
RoHS conform | Yes |
HTSUS | 8504.40.9580 |
SVHC free | Yes |
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