IC DSP ARM SOC BGA | Texas Instruments
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Available: 440 pcs.
Next delivery: 8190 pcs.
Manufacturer Leadtime: **
Description
The X66AK2H12AAW2 is a common industry DSP (Digital Signal Processors) housed in a RoHS compliant 1517-BBGA, FCBGA package by Texas Instruments made. The X66AK2H12AAW2 is using SPQ 21 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
Mfr | Texas Instruments |
Series | 66AK2Hx KeyStone Multicore |
Package | Tray |
Product Status | Discontinued |
Type | DSP+ARM |
Interface | EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0 |
Clock Rate | 1.2GHz |
Non-Volatile Memory | ROM (384kB) |
On-Chip RAM | 12.75MB |
Voltage - I/O | 0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V |
Voltage - Core | Variable |
Operating Temperature | 0°C ~ 85°C (TC) |
Mounting Type | Surface Mount |
Package / Case | 1517-BBGA, FCBGA |
Supplier Device Package | 1517-FCBGA (40x40) |
Base Product Number | X66AK2 |
Logistics
Country of origin | HK |
Customs tariff number | - |
Original Packaging | Reel with 21 pieces |
Compliance
RoHS conform | Yes |
HTSUS | 8504.40.9580 |
SVHC free | Yes |
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X66AK2H12AAW2 ECAD module
X66AK2H12AAW2 specification
X66AK2H12AAW2 certificate