IC AMPLIFIER DBS37P | NXP USA Inc.
Amplifier IC 4 Half Bridge Class AB 37-PDBS
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Unit Price ($ / pc.)
$
*
Available: 185 pcs.
Next delivery: 2835 pcs.
Available in 1 Weeks
Manufacturer Leadtime: **
Quantity
Price per unit*
100 pcs.
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500 pcs.
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1000 pcs.
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3000 pcs.
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10000 pcs.
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**Subject to prior sale
Description
The TDF8555J/N2,112 is a common industry Audio Amplifiers housed in a RoHS compliant 37-SSIP Formed Leads package by NXP USA Inc. made. The TDF8555J/N2,112 is using SPQ 13 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
| Mfr | NXP USA Inc. |
| Series | - |
| Package | Tube |
| Product Status | Obsolete |
| Type | Class AB |
| Output Type | 4 Half Bridge |
| Max Output Power x Channels @ Load | 64W x 1 @ 2Ohm; 45W x 2 @ 4Ohm |
| Voltage - Supply | 6V ~ 18V |
| Features | - |
| Mounting Type | Through Hole |
| Operating Temperature | -40°C ~ 105°C (TA) |
| Supplier Device Package | 37-PDBS |
| Package / Case | 37-SSIP Formed Leads |
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Logistics
| Country of origin | HK |
| Customs tariff number | - |
| Original Packaging | Reel with 13 pieces |
Compliance
| RoHS conform | Yes |
| HTSUS | 8504.40.9580 |
| SVHC free | Yes |
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