IC SRAM 18MBIT PAR 165FBGA | Infineon Technologies
SRAM - Synchronous, DDR II+ Memory IC 18Mbit Parallel 550 MHz 165-FBGA (13x15)
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Unit Price ($ / pc.)
25.87941 $
*
Available: 302 pcs.
Next delivery: 5292 pcs.
Available in 2 Weeks
Manufacturer Leadtime: 12 Weeks **
Quantity
Price per unit*
100 pcs.
24.58544 $
500 pcs.
23.291469 $
1000 pcs.
21.997499 $
3000 pcs.
20.703528 $
10000 pcs.
19.409558 $
*incl. VAT plus
shipping costs
**Subject to prior sale
Description
The CY7C1170KV18-550BZC is a common industry Memory housed in a RoHS compliant 165-LBGA package by Infineon Technologies made. The CY7C1170KV18-550BZC is using SPQ 136 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
| Mfr | Infineon Technologies |
| Series | - |
| Package | Tray |
| Product Status | Active |
| Programmable | Not Verified |
| Memory Type | Volatile |
| Memory Format | SRAM |
| Technology | SRAM - Synchronous, DDR II+ |
| Memory Size | 18Mbit |
| Memory Organization | 512K x 36 |
| Memory Interface | Parallel |
| Clock Frequency | 550 MHz |
| Write Cycle Time - Word, Page | - |
| Voltage - Supply | 1.7V ~ 1.9V |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 165-LBGA |
| Supplier Device Package | 165-FBGA (13x15) |
| Base Product Number | CY7C1170 |
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Logistics
| Country of origin | HK |
| Customs tariff number | - |
| Original Packaging | Reel with 136 pieces |
Compliance
| RoHS conform | Yes |
| HTSUS | 8504.40.9580 |
| SVHC free | Yes |
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