SP,CON,AU,TNR 10X3X6MM | Laird Technologies EMI

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Unit Price ($ / pc.)
0.6263 $ *
Available: 958 pcs.
Next delivery: 19068 pcs.
Available in 9 Weeks
Manufacturer Leadtime: 15 Weeks **
Quantity
Price per unit*
100 pcs.
0.594985 $
500 pcs.
0.56367 $
1000 pcs.
0.532355 $
3000 pcs.
0.50104 $
10000 pcs.
0.469725 $
*incl. VAT plus shipping costs
**Subject to prior sale
Description

The 67B3G3006010010R0C is a common industry RFI and EMI - Contacts, Fingerstock and Gaskets housed in a RoHS compliant Standar package by Laird Technologies EMI made. The 67B3G3006010010R0C is using SPQ 500 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com

Technical specifications
MfrLaird Technologies EMI
SeriesB3G
PackageBulk
Product StatusActive
TypeFingerstock
Shape-
Width0.119 (3.00mm)
Length0.236 (6.00mm)
Height0.394 (10.00mm)
MaterialBeryllium Copper
PlatingGold
Plating - Thickness-
Attachment MethodSolder
Operating Temperature-
Shelf Life Start-
Shelf Life12 Months
Storage/Refrigeration Temperature50°F ~ 77°F (10°C ~ 25°C)
Logistics
Country of originHK
Customs tariff number-
Original PackagingReel with 500 pieces
Compliance
RoHS conformYes
HTSUS8504.40.9580
SVHC freeYes