SP,CON,AU,TNR 10X3X6MM | Laird Technologies EMI
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Unit Price ($ / pc.)
0.6263 $
*
Available: 958 pcs.
Next delivery: 19068 pcs.
Manufacturer Leadtime: 15 Weeks **
Description
The 67B3G3006010010R0C is a common industry RFI and EMI - Contacts, Fingerstock and Gaskets housed in a RoHS compliant Standar package by Laird Technologies EMI made. The 67B3G3006010010R0C is using SPQ 500 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
Mfr | Laird Technologies EMI |
Series | B3G |
Package | Bulk |
Product Status | Active |
Type | Fingerstock |
Shape | - |
Width | 0.119 (3.00mm) |
Length | 0.236 (6.00mm) |
Height | 0.394 (10.00mm) |
Material | Beryllium Copper |
Plating | Gold |
Plating - Thickness | - |
Attachment Method | Solder |
Operating Temperature | - |
Shelf Life Start | - |
Shelf Life | 12 Months |
Storage/Refrigeration Temperature | 50°F ~ 77°F (10°C ~ 25°C) |
Logistics
Country of origin | HK |
Customs tariff number | - |
Original Packaging | Reel with 500 pieces |
Compliance
RoHS conform | Yes |
HTSUS | 8504.40.9580 |
SVHC free | Yes |
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